Fedder and colleagues published in Advanced Materials
Vice Provost for Research and Professor of Electrical and Computer Engineering Gary Fedder, along with Professor of Mechanical Engineering Philip LeDuc, and
Abstract
The approach toward a stretchable electronic substrate employs multiple soft polymer layers patterned around silicon chips, which act as surrogates for conventional electronics chips, to create a controllable stiffness gradient. Adding just one intermediate polymer layer results in a six-fold increase in the strain failure threshold enabling the substrate to be stretched to over twice its length before delamination occurs.
Read the paper here.