AG Associates Heatpulse 210 Rapid Thermal Annealer



Description

 ... to top


Usage Policy

 ... to top


Contact

Name:
Office:
Extension:
Email:

 ... to top


Qualified Users List

Name Office Extension Email
Ê Ê
Ê  
etc.

 ... to top


Standard Operating Procedures

(detailed specifications for all components of the RTA system can
 be found in the appropriate pamphlet on the stainless steel shelves adjacent 
 to the sputtering system.)                         


* observation items
- action items


General Operating Safety

* This piece of equipment is a source of high voltage, high current and 
  high thermal energy. Do not use it without proper training. Respect it.

- If a malfunction occurs, do not attempt to fix the problem yourself. The only
  appropriate action by the typical user is the throwing of the main power switch
  (on the switch box mounted on the wall to the left of the RTA unit) to the OFF
  position if the unit appears to be in a state which is harmful to itself or
  lab users.  Contact the appropriate personnel if malfunctions occur.


Operating Procedures

- Observe that system appears to be in good working condition.
- Open sliding shuttle door and mount sample on Si substrate holder
- Close door
- Open regulator valve on appropriate gas bottle if you are annealing in a non-air
  ambient
- Turn on power switches to annealer module (left side of front panel) and keyboard
  control module (left side of back panel)
- Program desired temperature setpoint and dwell time
        - type "Return" to enter set mode
        - type "S" to enter time/temperature setpoint mode
        - type "A" to enter temperature setpoint mode
        - key in desired temperature setpoint
        - type "Return"
        - type "S" to enter time/temperature setpoint mode
        - type "T" to enter dwell time mode
        - key in desired dwell time (in seconds)
        - type "Return"
        - type "A" to run cycle


* This unit is incapable of temperature control below 300 C and incapable of 
  accurate temperature control below about 400 C.
* This unit is not designed for annealing times over several minutes 
  (ie RAPID thermal annealer). High-temperature anneals for extended time periods
  unnecessarily shorten the lifetime of the unit. Use a conventional furnace
  for extended-time anneals.
* For more sophisticated temperature profile control, refer to the Owners Manual.

 ... to top


Applications Notes

 ... to top


Useful Links

 ... to top


Miscellaneous

 ... to top