 |
A micromirror achieves up to ±4 7° angular displacement with 18 Vdc by a comb-drive design that uses vertical angled offset of the comb fingers. Structures are made from a combination of CMOS interconnect layers and a thick underlying silicon layer. Electrical isolation of the silicon fingers is realized with a slight silicon undercut etch, which disconnects sufficiently narrow pieces of silicon under the CMOS microstructures. The 1 mm by 1 mm micromirror is made of an approximately 40 µm-thick single-crystal silicon plate coated with aluminum from the CMOS interconnect stack. The mirror has a peak-to-peak curling of 0.5 µm. Fabrication starts with a conventional CMOS process followed by dry-etch micromachining steps. There is no need for wafer bonding and accurate front-to-backside alignment. Such capability has potential applications in biomedical imaging, optical switches, optical scanners, interferometric systems, and vibratory gyroscopes.
|
|
Full
paper (PDF) (opens in new window).
|
