CMU MEMS Laboratory Publication Abstract


in Technical Digest of the 9th IEEE International Workshop on Micro Electro Mechanical Systems (MEMS), pp. 13-18, February 15-17, 1996, San Diego, CA, USA.
Laminated High-Aspect-Ratio Microstructures in a Conventional CMOS Process
G. Fedder, S. Santhanam, M. L. Reed, S. C. Eagle, D. F. Guillou, M. S. Lu and R. Carley
Electrostatically actuated microstructures with high-aspect-ratio laminated-beam suspensions have been fabricated using conventional CMOS processing followed by a sequence of maskless dry-etching steps. Laminated structures are etched out of the CMOS silicon oxide, silicon nitride, and aluminum layers. The key to the process is use of the CMOS metallization as an etch-resistant mask to define the microstructures. A minimum beam width and gap of 1.2 microns and maximum beam thickness of 4.8 microns are fabricated in a 0.8-micron 3-metal CMOS process available through MOSIS. Structural features will scale in size as the CMOS technology improves. An effective Young's modulus of 63 GPa is extracted from resonant frequency measurements. Cantilevered structures slightly curl up with a radius of curvature of about 4.2 mm. Multi-conductor electrostatic micromechanisms, such as self-actuating springs and nested comb-drive lateral resonators, are successfully produced. Self-actuating springs are self-aligned multi-conductor electrostatic microactuators that are insensitive to curl. The resonance amplitude is 1 micron for an 107 micron-wide x 109 micron-long spring with an applied 11 V ac signal. Finite-element simulation using the extracted value for Young's modulus predicts the resonant frequency of the springs to within 6% of the measured values.
© 1996 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Full paper (PDF) (opens in new window).

This page was generated in 0.028182 seconds at 09:06:25 pm EDT on 20 May 2018.

overview | projects | people | publications | intranet | resources         © 1998-2009  Carnegie Mellon