CMU MEMS Laboratory Publication Abstract

 

in 194th Meeting of Electrochemical Society (ECS), pp. 33-42, November 1-6, 1998, Boston, MA, USA.
Factorial Experiment on CMOS-MEMS RIE Post Processing
X. Zhu, D. Greve, R. Lawton, N. Presser and G. Fedder
ABSTRACT:
CMOS-MEMS is a promising approach to achieve integration of microelectromechanical structures with circuits by using foundry CMOS services coupled with post-CMOS processing. The most significant benefit is the low cost of manufacturing the mechanical structures with CMOS. We report suitable conditions for post-CMOS processing by reactive ion etching (RIE) to define the mechanical structures. Values of power, pressure and gas flows are determined which achieve acceptable mechanical integrity, electrical continuity, etch rate and selectivities of the metal etch mask over the CMOS dielectric materials. Results are presented from a Box-Behnken factorial experiment to achieve these goals.
© 1998 The Electrochemical Society, Inc. ECS reserves the right to publish proceedings of any symposia from its Meetings. Anyone (including Symposium organizers) may not publish proceedings of any symposia outside of the ECS publications program without the express, written permission of the ECS Publication Committee
Full paper not available from outside CMU


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