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This paper provides an overview of CMOS-based sensor technology with specific attention placed on devices made through micromachining of CMOS substrates and thin films. Microstructures may be formed using either pre-CMOS, intra-CMOS and post-CMOS fabrication approaches. To illustrate and motivate monolithic integration, a handful of microsystem examples, including inertial sensors, gravimetric chemical sensors, microphones, and a bone implantable sensor will be highlighted. Design constraints and challenges for CMOS-MEMS devices will be covered.
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