CMU MEMS Laboratory Publication Abstract

 

in Proceedings of the 2005 IEEE Engineering in Medicine and Biology 27th Annual Conference (EMBS), September 1-4, 2005, Shanghai, China.
BioImplantable Bone Stress Sensor
J. F. Alfaro, L. Weiss, P. G. Campbell, M. C. Miller, C. Heyward, J. S. Doctor and G. Fedder
ABSTRACT:
The clinical management of skeletal trauma and disease relies on radiographic imaging to infer bone quality. However, bone strength does not neccessarily correlate well with image intensity. There is a need for a safe and convenient way to measure bone strength in situ. This paper presents a new technique to directly measure bone strength in situ at a microlevel scale through a MicroElectroMechanical System (MEMS) sensor.

The proposed MEMS stress sensor comprises an array of piezoresistive sensor "pixels" to detect stress across the interfacial area between the MEMS chip and bone with resolution to 100 Pa, in 1 sec averaging. The sensors are located within a textured surface to accommodate sensor integration into bone. From initial research, surfac topography with 30-60 µm features was found to be conductive to guiding new cell growth. Finite element analysis has led to a sensor design for normal and shear stress detection.

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Full paper (PDF) (opens in new window).


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