CMU MEMS Laboratory Publication Abstract


in Technical Report, August 2003, Carnegie Mellon University, Pittsburgh, PA.
RF to DC Converter in SiGe
M. Sperling
Wireless sensor chips have many applications including biomedical monitoring, distributed sensors within civil infrastructure and for sensors implanted within the body. Wireless communication and powering of sensors has been accomplished in small modules, but not completely on chip as traditional power sources are too large and bulky. One approach to a chip sized wireless power source is a telemetry system to power the sensor. Wireless telemetry systems require the use of an antenna which will inductively couple power onto the chip. Previous work in this field includes that done by Huang et. al [1], Marschner et. al [2] and Schuylenbergh & Puers [3]. Marschner separates the transmitter and energy reception into two different off-chip antennas. Huang and Schuylenbergh & Puers both condense their design to use only one antenna, but in both cases they are still off-chip and the frequency of operation is very low. At high enough frequencies the antenna length requirement decreases, enabling it to be placed entirely on chip. This section of the paper contains the design and test of a circuit to be used at these very high frequencies with all on-chip components. Circuit simulation was done through spectre with layout and fabrication through the spring 2002 and beginning of fall 2002 semesters. Fabrication was completed in February 2003, with chip characterization completed by summer 2003. The results showed a constant regulated voltage output that was higher than expected due to process variations. The bandgap circuit showed a constant voltage output that matched simulation data, though the startup voltage necessary to obtain this functionality was higher than expected. Future work includes using high breakdown voltage transistors as well as larger transistors and capacitors for operation at both low and high input voltages.
© 2003 Carnegie Mellon University, Department of Electrical and Computer Engineering.
Full paper (PDF) (opens in new window).

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