CMU MEMS Laboratory Publication Abstract

 

	in Proceedings of the 2003 IEEE International Ultrasonics Symposium (UFFC-S), October 5-8, 2003, Honolulu, Hawaii.
	Robust Capacitive MEMS Ultrasonic Transducers for Liquid Immersion
	D. Greve, J. Neumann, I. J. Oppenheim, S. P. Pessiki and D. Ozevin ABSTRACT:
	Capacitive diaphragm MEMS ultrasonic transducers are of great interest because they offer wide bandwidth and ready integration into arrays. However, fragility of these transducers is a significant barrier to their application. In this talk, we report on robust transducers which have been fabricated using the MUMPS process. The transducer design has been optimized to minimize stray capacitance between the output node and the substrate. We report the use of a protective silicone layer which protects the transducers from liquid exposure and, to a degree, from mechanical damage. The silicone layer has been applied with high transducer yield without the need for prior closure of the etch holes, and coated transducers survive extended immersion in water. The thickness of the silicone layer must be carefully controlled, however, in order to prevent pulse distortion.
	© 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
	Full paper (PDF) (opens in new window).

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