CMU MEMS Laboratory Publication Abstract


in Proceedings of the IEEE Sensors Conference (IEEE Sensors), pp. 1413-1418, July 11-14, 2002, Orlando, Florida.
A DRIE MEMS Gyroscope
H. Xie and G. Fedder
The gyroscope reported in this paper is a lateral-axis angular rate sensor with in-plane vibration and out-of-plane Coriolis acceleration sensing. The sensor plus on-chip CMOS circuitry is about 1 mm by 1 mm in size and is fabricated by a post-CMOS micromachining process that uses interconnect metal layers as etching mask(s) and a single-crystal silicon layer as the structural material. The resultant device incorporates both 1.8 µm-thick thin-film structures and 60 µm-thick bulk Si structures to simultaneously achieve spring beams with either in-plane or out-of-plane compliance. The microstructure is flat and avoids the curling problem existing in thin-film CMOS gyroscopes. A unique silicon electrical isolation technique is used to obtain individually controllable comb fingers. The noise floor of the gyroscope is 0.02 º/s/Hz½ at 5 Hz.
© 2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Full paper (PDF) (opens in new window).

This page was generated in 0.011589 seconds at 08:53:36 pm EST on 22 Jan 2018.

overview | projects | people | publications | intranet | resources         © 1998-2009  Carnegie Mellon