 |
Post CMOS-MEMS processes [1] have advantages of multi-layer routing in mechanical structures and the potential to integrate inertial measurement units (IMUs) with supporting circuitry in a conventional CMOS process. Multiple IMUs are integrated into a single chip to improve the system performance and significantly decrease the cost. In contrast to previous work [2], this system integrates two lateral accelerometers and a vertical gyroscope with all signal processing circuits. A direct-coupled continuous-time sensing buffer for MEMS capacitive sensing has a –3dB frequency corner lower than 10Hz. The integration of multiple sensors makes cross-device compensation possible.
|
 |
Full
paper (PDF) (opens in new window).
|