Monolithic integration of MEMS processing technology with standard
CMOS processes enables the combination of novel sensing and actuation
functionality on traditional computing and communication devices
allowing the ubiquitous digital computer to interact with the world
around it. Paralleling the rest of the semiconductor industry, this
integration requires both the ability for rapid custom design for low
cost prototyping and design optimzation for high volume
manufacturing. In this project, we are collaborating with
MEMSCAP in creating the design,
fabrication and characterization support for achieving this goal.
Potential devices to be designed and fabricated in the process include
accelerometers, gyroscopes, radio frequency (RF) MEMS communication
systems (with resonator oscillators, RF filters and high-Q inductors),
infrared sensors and imagers, electrothermal converters, and force
sensors. In additional to individual devices, the technology enables
integration of multiple devices on the same chip with supporting
electronics. For example, high-Q inductors and micromechanical
resonators can be combined for CMOS RF applications. In another
example, multiple accelerometers are integrated on chip to create a
3-axis inertial measurement system. Furthermore, both the
communications and accelerometer systems can be combined to form a
wireless microsensor system. Such a system is primarily driven by
low-volume applications and will not be commercially viable if
manufactured in today's specialized MEMS processes. Realization of
these kinds of systems is within reach of the CMOS micromachining
technology and through ASIMPS, reduces to a problem of design effort
and end-application know-how, not of process development.