Yanwen Fei Carnegie Mellon University

Product Based Boundless Deformation Characterization

IC product performance and yield have been significantly influenced by the process induced IC structure deformations nowadays. In order to achieve acceptable yield, process-induced deformations need to be characterized in both time and spatial frame to provide information for the designers and the manufacturers. Traditionally, test structure based characterization method has been used, but it has limitations in the capability of collecting data for the high frequency deformations that have increasing impacts in the advanced technology.

In this talk, we will introduce a product based characterization method for characterizing the non-spot defect deformation. The product based characterization method we propose tests the sub-circuit in the real product by the designed test schemes. From the wafermap that built from the test result, deformation source can be identified, and the value can be extracted. This method does not require extra mask set or extra silicon, so the cost is low. The reuse and regularity of the design can increase the sampling frequency.

Bio:

Yanwen Fei is a PhD student under the guidance of Prof. Wojciech Maly in the Electrical and Computer Engineering Department at Carnegie Mellon University. She received her MS and BS from Tsinghua University in China. Prior to coming to CMU, Yanwen worked as device engineer at Motorola. Her research interests lie in various aspects of DFM including yield prediction, characterization and modeling of process induced deformation.