Emerging 3D Stacking and Non-volatile memory technologies and their impact on Computer Design

Wednesday April 28, 2010
4:00 pm


Yuan Xie
Pennsylvania State University


The growing complexity of advanced deep-submicron technology used to build computing systems has resulted in many design challenges for future computing systems, such as power limits, limited communication bandwidth and latency, and reduced system reliability. At the same time, various disruptive emerging technologies promise dramatically improved performance at the device level. How likely are these improvements and what impact will they have at the circuit and architecture level? In this talk, I will present an overview of two emerging technologies: 3D integration and new non-volatile memory technologies. I will describe the fundamentals and current status of each technology, introduce the advantages of the technologies, and discuss the design challenges inherent in adoption of the technologies, and give an overview of the research activities in my group. A preview of these two research areas can be found at http://www.cse.psu.edu/~yuanxie/3d.html and http://www.cse.psu.edu/~yuanxie/nvm.html


Prof. Yuan Xie received the B.S. degree from Tsinghua University and the M.S. and Ph.D. degrees in electrical engineering from Princeton University. He is currently Associate Professor in CSE department at the Pennsylvania State University. Before joining Penn State in Fall 2003, he was with IBM Microelectronic Division's Worldwide Design Center. Prof. Xie is a recipient of the NSF CAREER award, the SRC Inventor Recognition Award, IBM Faculty Award, several Best Paper Award and Best Paper Award Nominations at IEEE/ACM conferences. He has published more than 100 papers in journals and refereed conference proceedings, in the area of EDA, computer architecture, VLSI circuit designs, and embedded systems. His current research projects focus on 3D IC design and emerging memory technologies. He is currently Associate Editor for ACM Journal of Emerging Technologies in Computing Systems (JETC), IEEE Transactions on Very Large Scale Integration Systems (TVLSI), IEEE Transactions on Computer Aided Design of Integrated Circuits (TCAD), IEEE Design and Test of Computers, IET Computers and Digital Techniques (IET CDT). He is ACM Distinguished Speaker. He is also a co-editor of the first 3D IC book on EDA, Design and Architecture (Springer 2009).

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