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| + | ======Title: Die Stacking is Happening ====== | ||
| + | ==== Bryan Black ==== | ||
| + | == Tuesday, April 29th, 4:30pm-5:30pm == | ||
| + | == Panther Hollow, CIC == | ||
| + | ===Abstract:=== | ||
| + | This is the Micro 46 Keynote talk. It starts with a sample die stacking | ||
| + | technology flow illustrating interesting interactions between technology and | ||
| + | design. It will then explain why, after more than 10 years of development, | ||
| + | die stacking is finally happening in mainstream computing. The talk will | ||
| + | close with an outline of how die stacking is going to impact the industry. | ||
| + | Along the way perhaps some exciting areas of research will be discussed. | ||
| + | |||
| + | ===Bio:=== | ||
| + | Bryan Black received his BS, MS, and Ph.D. from Carnegie Mellon. With over | ||
| + | 20 years of experience Black has had the honor of working at Motorola, | ||
| + | Intel, and AMD. He has done a little of everything from devices to circuits | ||
| + | to microarchitecture to DRAM to test to packaging. Black began his research | ||
| + | into die stacking over 10 years ago. The work has matured and Black is now | ||
| + | focused on product development and high volume manufacturing of the | ||
| + | technology. Black is a Senior AMD Fellow and runs the AMD die stacking | ||
| + | program. | ||
