This is the Micro 46 Keynote talk. It starts with a sample die stacking technology flow illustrating interesting interactions between technology and design. It will then explain why, after more than 10 years of development, die stacking is finally happening in mainstream computing. The talk will close with an outline of how die stacking is going to impact the industry. Along the way perhaps some exciting areas of research will be discussed.
Bryan Black received his BS, MS, and Ph.D. from Carnegie Mellon. With over 20 years of experience Black has had the honor of working at Motorola, Intel, and AMD. He has done a little of everything from devices to circuits to microarchitecture to DRAM to test to packaging. Black began his research into die stacking over 10 years ago. The work has matured and Black is now focused on product development and high volume manufacturing of the technology. Black is a Senior AMD Fellow and runs the AMD die stacking program.