High-volume IC lithography is reaching 32nm feature sizes and research efforts are pushing toward 25nm lines and spaces. A huge potential for new IC devices is created by the ability to reliably pattern mechanical features with such fine resolution. This course builds the ideas developed in the existing MEMS graduate courses (18-614, 18-615, and 18-724) with a special focus on the nano-mechanical world; particularly when nanometer dimensions allow the creation of new types of devices rather than just scaling existing devices. This course will explore a number of examples of potential nano-electro-mechanical systems (NEMS). Topics to be addressed in this class include: (1) the creation and controlled assembly of nano-particles using electric-field assisted assembly, (2) the use of nano-particles and surface adhesion forces for creation of ultra-dense non-volatile memories, (3) the use of nanometer scale mechanical released beams and actuators in order to create precise nano-mechanical positioning for data storage and tip-based lithography applications, and (4) the use of nanometer scale ion beam confinement and control structures (e.g., such devices can be used to create single-ion quantum computing elements) manufactured using IC lithography.